CT Semiconductor

CT Semiconductor is a member of CT Group, a Vietnamese conglomerate, established to build the country’s first OSAT (Outsourced Semiconductor Assembly and Test) facility fully owned and operated by Vietnamese engineers. The project broke ground in Thuan An, between Ho Chi Minh City, Binh Duong and Dong Nai, with phase two construction started in April 2025, addressing growing demand for domestic chip packaging and testing capacity.

The facility performs semiconductor assembly, final testing with automated test equipment, and failure analysis across three packaging categories: lead-frame ICs, PCB/substrate-based packages such as SiP and BGA, and wafer-level chip scale packages. CT Semiconductor targets fabless chip designers and electronics manufacturers needing regional packaging and test capacity, with a target output of 100 million chips per year by 2027.

1. OSAT packaging: Provides lead-frame, PCB/substrate (SiP, BGA) and wafer-level chip scale packaging for fabless chip designers.

2. Automated final test: Uses automated test equipment (ATE) to verify chip functionality before shipment.

3. Failure analysis: Runs failure analysis to diagnose defects and support yield improvement.

4. Vietnam-based capacity: Located in Thuan An, near Ho Chi Minh City, as a Vietnam-based OSAT option.

5. Scaling output: Targets 100 million packaged chips per year by 2027 as phase two proceeds.

6. Future R&D: Plans research into GaN power devices and photonic components for next-generation chips.