Soitec

Soitec is a French semiconductor materials company founded in 1992 and headquartered in Bernin, near Grenoble, listed on Euronext Paris under ticker SOI. It was created to commercialize Smart Cut technology, a wafer-bonding and layer-transfer process that produces engineered silicon-on-insulator (SOI) substrates for chipmakers needing more power-efficient, higher-performing base materials than standard silicon.

The company manufactures engineered substrate families such as RF-SOI, FD-SOI, Power-SOI, SmartSiC, Photonics-SOI and Imager-SOI, sold directly to foundries and integrated device manufacturers that build mobile RF, automotive, industrial and AI-computing chips. Substrates are produced at its Bernin site in France, with sales and engineering support from offices in Singapore, Shanghai, Tokyo, Hsinchu, Hwaseong and Hasselt.

1. RF-SOI wafers: substrates that cut power loss and signal interference in mobile RF front-end chips.

2. FD-SOI platform: fully-depleted SOI logic substrates for low-power, high-performance IoT and automotive chips.

3. SmartSiC: engineered silicon carbide substrates for power electronics in EVs and industrial systems.

4. Photonics-SOI and Imager-SOI: substrates for optical communication and image-sensor semiconductor applications.

5. Global manufacturing base: production site in Bernin, France, plus engineering and sales offices across Asia and Europe.

6. R&D-driven roadmap: about 19% of FY2026 revenue reinvested in engineered-substrate research and development.